In recent years, the automotive industry has been rapidly transformation toward intelligent and electrified vehicle technologies, resulting in a significant increase in the adoption of automotive electronics. Consequently, electromagnetic compatibility (EMC) has emerged as a key technical issue of growing importance. The technology focuses on electrostatic discharge (ESD), bulk current injection (BCI), and transverse electromagnetic (TEM) cell simulation established of printed circuit board assemblies (PCBAs) for automotive electronic products. This technology enables the evaluation of a product’s electromagnetic susceptibility (EMS) performance at the early design stage, thereby reducing the time and cost incurred by troubleshooting in the later stage.

1.Import of Simulation： 

a. The PCBA ECAD files (odb++  or IPC2581 format). 

b. E-BOM. 

c. The stack-up informations of the PCBA. 

d. Material properties (such as Dielectric Constant, Loss Tangent,…etc.) 

e. The IBIS model of active components. 

f. The datasheet of electronic components.

2.Export of Simulation： 

 a. The voltage curves of the traces for PCBA. 

 b. The current curves of the traces for PCBA. 

 c. The field distribution of TEM cell.

This technology can be applied in electric vehicle and of automotive electronics.

The technology can make domestic electric vehicle key component or automotive electronics manufacturers to establish product EMC design and development capabilities, and they will get opportunities of getting into the international car manufacturers supply chain to meet future trend of emerging market demand for electric vehicle or automotive electronics requirement.